Electronic Manufacturing Engineering Support

Pre-production: DFM and file review

Gerber, BOM and Pick & Place files are checked for trace spacing, pad/hole ratio, footprint fit, polarity and panelisation. Findings are reported in priority order with a fix proposal.

Component-selection consulting

Wrong footprints, long-lead-time or end-of-life part choices are caught at the design stage. Alternatives that meet the electrical and thermal requirement and are actually procurable are proposed.

Post-production: rework and failure analysis

On boards that do not work, are damaged in the field or need a revision, we do component replacement, BGA reball, cut/jumper rework and visual / X-ray failure analysis.

Engineering support scope

How to get engineering support

1. 01Share the situationSend your files, photos of the non-working board or your revision request.
2. 02Initial assessmentThe team reviews the case and comes back with scope, time and cost.
3. 03Report and solutionDFM findings are reported, or rework/repair is applied; before/after records are shared.
4. 04Handover to productionWith the approved fixes, the board is made ready for series production.

Engineering support FAQ

Can I ask for a DFM review only?

Yes. You can take file and DFM review on its own without placing a production order; the findings report is delivered to you.

Do you repair boards made elsewhere?

Yes. Regardless of where they were built, we do rework and failure analysis on non-working, damaged or revision-needed boards.

How do you detect a solder fault under a BGA?

Connections under BGA/µBGA are imaged by X-ray; a reball is applied if needed and verified afterwards by X-ray.

How is the engineering support fee set?

It is set by scope (review, rework count, failure-analysis depth) and time; an exact quote is given after the initial assessment.

Related services

• PCB assembly order
• PCB order and fabrication
• Turnkey projects